Job Description:

The candidate must be a US Citizen or Green card Holder.

• Develops SMT assembly and soldering processes in medium to high-mixed complex PCBA environment.
• Plan and develop process and capacity utilization strategies for SMT assembly operations.
• Develop solder paste printing, automated solder paste inspection, component placement, reflow soldering, and automated optical inspection (AOI) processes.
• Develop SMT solder paste reflow profiles to ensure proper solder wetting.
• Identify the root cause of yield/ quality issues and work with internal design/ application groups as well as vendors to develop corrective action.
• Ensure production readiness of key processes in PCB assembly cycle.
• Continuously improve SMT processes and yields.
• Design experiments to develop optimum production processes such as solder paste selection, stencil designs, feeder set up methodology, and selective soldering techniques.
• Optimize machine set up and programming.
• Collaborate with internal teams on New Product Introductions (NPI); Interface with customers on pre-assembly or post-assembly concerns.
• Manipulate data files using Gerber, ODB++, various CAD packages and 3D modeling, AutoCAD and SolidWorks.
• Other duties may be assigned.